| Category | Specification |
|---|
| Product Name | NVIDIA Jetson AGX Orin / AGX Xavier IPC 8F3E1 Embedded Computer |
| Supported Modules | NVIDIA Jetson AGX Orin or NVIDIA Jetson AGX Xavier |
| Processor (Orin) | Up to 12‑core Arm® Cortex®‑A78AE 64‑bit CPU with cache |
| GPU (Orin) | NVIDIA Ampere architecture with up to 2048 CUDA cores and 64 Tensor Cores |
| AI Performance (Orin) | Up to ~200–275 TOPS AI inferencing performance (module dependent) |
| Memory (Orin) | Up to 32–64 GB 256‑bit LPDDR5 (module dependent) |
| Storage | eMMC + optional expansion (depends on module & carrier board) |
| Networking | 2× Gigabit Ethernet |
| USB Ports | 2× USB 3.0, 2× USB 2.0, 1× USB Micro‑B |
| Display Output | HDMI |
| Camera Interfaces | 1× 120‑pin CSI camera expansion header |
| Expansion | 2× MiniPCIe, 2× M.2 Key M slots |
| Serial & I/O | 2× CAN, 2× DB9 (RS‑232), GPIO, SPI, I2C, RTC |
| Cooling | Fan connector support |
| Input Power | DC +12 V |
| Dimensions | ~210 × 200 × 60 mm |
| Operating Temperature | −20 °C to +65 °C |
| Typical Use | AI edge computing, robotics, industrial automation, IoT |
Product Description:
The NVIDIA Jetson AGX Orin / AGX Xavier IPC 8F3E1 is a high‑performance industrial embedded computer designed to support either NVIDIA Jetson AGX Orin or Jetson AGX Xavier AI modules, giving system designers flexibility to choose the exact processing platform based on application performance needs. At its core, this compact IPC integrates an advanced carrier board capable of accommodating the powerful Jetson AGX Orin module — delivering up to 200–275 TOPS of AI inferencing performance, a multi‑core Arm® CPU, and a massive GPU with thousands of CUDA cores for demanding edge workloads such as computer vision, robotics, and automated inspection.
Built with industrial use cases in mind, the 8F3E1 offers robust connectivity including dual Gigabit Ethernet ports, multiple USB interfaces, and rich peripheral I/O such as CAN, RS‑232, SPI, I2C, and general‑purpose GPIO. Expansion capabilities are strong with MiniPCIe and M.2 Key M slots for additional modules like NVMe storage or cellular connectivity. A dedicated camera header supports high‑resolution vision systems.
The device supports reliable operation across a wide temperature range and uses a fan‐enabled cooling design suitable for both production floors and mobile AI systems. From autonomous robots and smart surveillance to industrial IoT and machine automation, the AGX Orin / AGX Xavier IPC 8F3E1 provides a flexible and powerful edge AI platform.
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